Tool/software:
Hello,
I am using a battery powered DRV8311P in a motor control application. In my board layout, I am planning to keep PGND and AGND on different ground planes and then connect them near the battery 0V. The datasheet states: "To reduce noise coupling and EMI interference from large transient currents into small-current signal paths, grounding should be partitioned between PGND and AGND." So I believe this design strategy to be sound, however please advise if I should reconsider.
Now, my real question is in regards to the device thermal pad. Table 6-1 in the datasheet states that the thermal pad must be connected to PGND:
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However, section 12.1 Layout Guidelines states: "TI recommends connecting all non-power stage circuitry (including the thermal pad) to AGND to reduce parasitic effects and improve power dissipation from the device."
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Adding to the confusion as well is that Figure 12-1 Recommended Layout Example in the datasheet does not show any attempt at separating AGND and PGND.
Please provide clarification. Thank you!
