Part Number: DRV8801A-Q1
Hi Team,
In reading up on packing failure modes with overmolding, I’ve just learned that QFN packages are higher risk packages. The DRV8801A-Q1 is in a QFN package. In production, the device will be covered with a mold material, CTE ranging from 150 to 300 ppm/deg C temperature cycling.
I’m looking for any data or caution from you guys regard this package type and its use with our overmold material.
Looking forward to your feedback.
-Jared