Hi Rick,
I have read section 10.3 of the DRV8432 datasheet. The suggested thermal compound is Ceramique from Arctic Silver.
But this compound is insulating. Therefore, the chip's thermal pad will not be grounded even if the heatsink is.
The datasheet says, "It is also a good practice to connect the heatsink to system ground on the PCB board to reduce the ground noise."
So, the thermal slug on the top does not need external grounding? Is it grounded inside the chip?
Thanks in advance,
Michael
I have read section 10.3 of the DRV8432 datasheet. The suggested thermal compound is Ceramique from Arctic Silver.
But this compound is insulating. Therefore, the chip's thermal pad will not be grounded even if the heatsink is.
The datasheet says, "It is also a good practice to connect the heatsink to system ground on the PCB board to reduce the ground noise."
So, the thermal slug on the top does not need external grounding? Is it grounded inside the chip?
Thanks in advance,
Michael